NAP100®

Take Sn/Cu as basis jointing a trace of Ni and P becoming lead-free Sn/Cu/Ni alloy to improve solder’s wettability and liquidity.  It is able to reduce IMC formation rate and has marvelous solder joint performance in wave soldering and HASL process than Sn/37Pb alloy.  Meanwhile its solder joint performance in lead-free wave soldering is smoother and brighter than high silver content alloy such as SAC305.NAP100 以Sn/Cu合金為基底,填加Ni, P微量元素,有效改善銲錫

NAP100- Process Parameter & Pilot Run Test

NAP100 Microstructure Analysis

NAP100 Reliability Test (2)- PCBA Microstructure Analysis

NAP100 Reliability Test (3)- PCBA Tin whisker Analysis